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Cure kinetics of PF/PVAc hybrid adhesive for manufacturing profiled wood-strand composites

Cure kinetics of PF/PVAc hybrid adhesive for manufacturing profiled wood-strand composites In thermoforming of profiled wood-strand composites, an adhesive system is needed to provide a weak initial bond to maintain mat integrity and architecture during the forming process and eventually a durable bond when the final cross-sectional shape is achieved. A hybrid adhesive composed of phenol formaldehyde (PF) and poly(vinyl acetate) (PVAc) is proposed in this study. The cure kinetics of this hybrid adhesive and bond development in a multi-step hot-pressing is discussed. Cure kinetics studied by differential scanning calorimetry indicated that adding PVAc slowed down the curing reaction of PF resin; however, the full cure of PF was not inhibited. The n th-order Borchardt Daniels ( n th-BD) model provided good prediction for the curing of adhesives with a PF/PVAc ratio lower than 1:1. To simulate roll forming of wood-strand mats, a hot-pressing schedule at low temperature combined with multi-stage closing and opening was developed. The n th-BD model was able to predict the actual bond development for composites made with neat PF resin. The results indicated that cure kinetics of a PF/PVAc hybrid adhesive would not significantly differ from neat PF resin for blend ratios of 1:1 or lower, thus potentially providing a resin system for roll forming or matched-die forming of wood-strand composites. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Holzforschung - International Journal of the Biology, Chemistry, Physics and Technology of Wood de Gruyter

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References (20)

Publisher
de Gruyter
Copyright
©2010 by Walter de Gruyter Berlin New York
Subject
Original papers
ISSN
0018-3830
eISSN
1437-434X
DOI
10.1515/HF.2010.079
Publisher site
See Article on Publisher Site

Abstract

In thermoforming of profiled wood-strand composites, an adhesive system is needed to provide a weak initial bond to maintain mat integrity and architecture during the forming process and eventually a durable bond when the final cross-sectional shape is achieved. A hybrid adhesive composed of phenol formaldehyde (PF) and poly(vinyl acetate) (PVAc) is proposed in this study. The cure kinetics of this hybrid adhesive and bond development in a multi-step hot-pressing is discussed. Cure kinetics studied by differential scanning calorimetry indicated that adding PVAc slowed down the curing reaction of PF resin; however, the full cure of PF was not inhibited. The n th-order Borchardt Daniels ( n th-BD) model provided good prediction for the curing of adhesives with a PF/PVAc ratio lower than 1:1. To simulate roll forming of wood-strand mats, a hot-pressing schedule at low temperature combined with multi-stage closing and opening was developed. The n th-BD model was able to predict the actual bond development for composites made with neat PF resin. The results indicated that cure kinetics of a PF/PVAc hybrid adhesive would not significantly differ from neat PF resin for blend ratios of 1:1 or lower, thus potentially providing a resin system for roll forming or matched-die forming of wood-strand composites.

Journal

Holzforschung - International Journal of the Biology, Chemistry, Physics and Technology of Woodde Gruyter

Published: Aug 1, 2010

Keywords: bonding; Borchardt Daniels model; cure kinetics; differential scanning calorimetry; hybrid adhesive; phenol formaldehyde; poly(vinyl acetate); profile forming; wood-strand

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